Package with semiconductor chip mounted on tape carrier by Tape Automated Bonding method

Packages where traces are formed on a flexible tape using photolithograph technology and a semiconductor chip is mounted on the tape carrier using TAB ( Tape Automated Bonding ) technique.

Appealing Points

  • Patterning is applied to a tape substrate using thin copper foil, pin formation of 25µm is possible.
  • The package thickness can be reduced to 1mm or less since IC chips are mounted directly on a tape substrate.
  • Can be bending-mounted except its plastic sealed section.