[COF]
Construction
Package with semiconductor chip mounted on tape carrier by Tape Automated Bonding method
Packages where traces are formed on a flexible tape using photolithograph technology and a semiconductor chip is mounted on the tape carrier using TAB ( Tape Automated Bonding ) technique.
Appealing Points
- Patterning is applied to a tape substrate using thin copper foil, pin formation of 25µm is possible.
- The package thickness can be reduced to 1mm or less since IC chips are mounted directly on a tape substrate.
- Can be bending-mounted except its plastic sealed section.